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Powder Sputtering Machine

Characteristic

Powder Sputtering is a technology which coats metals, ceramics, and various other materials at a nano level using a fine powder in a dry environment.

Optimal materials search

This technology is utilized for materials searches in various industries including batteries, catalysts, powder metallurgy, paints, electronic components, and cosmetics.

Co-sputtering film formation

We can do co-sputtering of binary and ternary targets.

Available Targets

Ir, Ru, Pt, Au, Ag, APC, Pd, Rh
Al, Si, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Zr, Nb, Mo, In, W
Various Li oxides, Al2O3, SiO2, TiN, ZrO2(YSZ), Ta2O5, Nb2O5

CONTACT

Frequently asked questions.

  • What is the maximum wafer size for film deposition?
  • What is the annealing temperature?
  • I'd like to reuse an used beet dish...
  • I would like to know the price of Ru nitrate and the recent metal price.
+81-3-5977-3388

Opening from 9:00 to 17:00 on weekdays