Interback Sputtering Machine
Specifications
We can form films on large substrates such as φ300Si wafers and glass for FPD.
| size of cathode | 5inch × 30inch |
|---|---|
| size of substrate（MAX） | 〜370㎜×470㎜ |
| Sub. Temperature（MAX） | 250℃ |
| Exhaust system | RP, CP |
| Power of Depo（MAX） | DC1500W X2 |
| Back Pressure（MAX） | 5.0×10－5Pa |
| Supttering Targets | Cr, Cu, Mo,Ta, Ti, ITO, IZO, Ag, APC-TR, APC-AR,APC-CH, APC-SR |
*Available materials are listed in the table mentioned above.
*Thickness and temperature uniformity in plane is ± 10%. There are some exceptions for some materials and sputter conditions.
CONTACT
Frequently asked questions.
- What is the maximum wafer size for film deposition?
- What is the annealing temperature?
- I'd like to reuse an used beet dish...
- I would like to know the price of Ru nitrate and the recent metal price.
+81-3-5977-3388
Opening from 9:00 to 17:00 on weekdays