Powder Sputtering Machine
Characteristic
Powder Sputtering is a technology which coats metals, ceramics, and various other materials at a nano level using a fine powder in a dry environment.
Optimal materials search
This technology is utilized for materials searches in various industries including batteries, catalysts, powder metallurgy, paints, electronic components, and cosmetics.
Co-sputtering film formation
We can do co-sputtering of binary and ternary targets.
Available Targets
Ir, Ru, Pt, Au, Ag, APC, Pd, Rh
Al, Si, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Zr, Nb, Mo, In, W
Various Li oxides, Al2O3, SiO2, TiN, ZrO2(YSZ), Ta2O5, Nb2O5
CONTACT
Frequently asked questions.
- What is the maximum wafer size for film deposition?
- What is the annealing temperature?
- I'd like to reuse an used beet dish...
- I would like to know the price of Ru nitrate and the recent metal price.
+81-3-5977-3388
Opening from 9:00 to 17:00 on weekdays